|
Home |
|
Overview |
|
About Us |
|
Management Team |
|
IC Assembly |
|
Custom Chip Packaging |
|
SMT |
|
Shanghai Partner |
|
Knowledge Center |
|
Contact Us |
|
Promex offers a variety of plastic and molded plastic packages delivered in a professional, rapid response manner. Our standard turn time is 4 to 5 working days. Premium deliveries are available from 8 hours or less, through 3 working days. We also co-ordinate wafer backgrinding to your specifications. |
Plastic package IC Assembly |
|
Silicon Valley’s Packaging Foundry |
|
· Quick turns in 8, 24, 48 or 72 hours · Au ball, Au wedge, Al wedge and Microbonds X-Wire™ available · In-house X-ray available · Commercial and MIL-STD-883 · Epoxy and eutectic die attach · Die separation and tracking |
|
© copy & copyright Promex Industries, Inc. www.promex-ind.com 2009 |
|
Promex Molded Plastic Package IC Assembly |
|||
|
type |
lead count |
body size |
solder |
|
SOIC |
8, 16 (heat sink option) |
0.150” |
plate |
|
|
14 |
0.150” |
plate |
|
|
16, 20, 24, 28 |
0.300” |
coat |
|
QSOP |
16 (heat sink option) |
0.150” |
plate |
|
SSOP |
30 |
5.3 mm |
plate |
|
MSOP |
8, 10 |
3.0 mm |
plate |
|
TSSOP |
20, 28 |
4.4 mm |
plate |
|
PDIP |
14,16, 18, 20, 24, 28 |
0.300” |
coat |
|
|
24, 28, 40 |
0.600” |
coat |