Promex Other IC Assembly Services

Promex provides a range of integrated in-house services to support rapid response IC assembly and pre-Asia production volumes. Assembly services include BGA assembly, COB and COF.

Additional capabilities

Promex offers several wire bonding options

Silicon Valley’s Packaging Foundry

· Wafer dicing and die singulation: Commercial & MIL-STD-883 Condition A (Class S) & Condition B

· Wire bonding: Au ball, Au wedge, Al wedge, Microbonds X-Wire™. 1.0 mil Au wire standard, 2.0 mil and 0.7 mil bond wire available.

· Stacked die wire bonding

· Die attach: eutectic & epoxy

· Die processing including shuttle die and “pizza” wafers

· Encapsulation

· Micro-dispense

· BGA IC assembly

· Chip-on-board (COB)

· Chip-on-Flex (COF)