Promex Other IC Assembly Services

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Overview

About Us

Management Team

IC Assembly

Custom Chip Packaging

SMT

Shanghai Partner

Knowledge Center

Promex provides a range of integrated in-house services to support rapid response IC assembly and pre-Asia production volumes. Assembly and Packaging services also include BGA assembly, BGA solder balling, Chip-on-Board, Chip-on-Flex and LED arrays.

SERVICES & capabilities

Promex offers state-of-the-art wire bonding

for lead frame based packages

Silicon Valley’s Packaging Foundry

· Wafer dicing and die singulation: Commercial & MIL-STD-883 Condition A (Class S) & Condition B

· Wire bonding: Au ball, Au wedge & ribbon, Al wedge, Microbonds X-Wire™. (1.0 mil Au wire standard, 2.0 mil and 0.7 mil bond wire available). Copper wire (1.0 mil & 0.8 mil)

· Wire bonding to 35 micron pitch

· Stacked die and die to die wire bonding

· Die attach: eutectic & epoxy

· Die processing including shuttle die and “pizza” wafers

· Encapsulation

· Micro-dispense

· BGA IC assembly and solder balling

· Chip-on-board (COB)

· Chip-on-Flex (COF)

· LED arrays (attach, wire bonding, encapsulation)