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Promex is continually expanding it’s line of copper lead frame based plastic open (air) cavity QFN package assembly services.  Individual packages and package arrays offer NiPdAu finish and premolded cavity walls to provide an industry leading larger cavity size.   Packages are available in a variety of pin counts in JEDEC sizes ranging from 3 x 3 mm to 12 x 12 mm.

Single packages or Arrays

· Premolded cavity walls

· Copper lead frame

· NiPdAu finish

· Assembly available in either singulated package or package array format

· Lids available

· Applications include prototype die probing, MEMS, sensor and RF packaging

               The complete line of unassembled open (air)  

                  cavity packages is available through our 

                   channel partner Mirror Semiconductor.  

 

 

                  View Mirror Semiconductor web site

 

                                www.mirrorsemi.com

  Plastic Molded Open (Air) Cavity QFN

 

Silicon Valley’s Packaging Foundry

© copy & copyright Promex Industries, Inc. & Mirror Semiconductor, Inc. www.promex-ind.com 2012