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Microbonds insulated X-Wire™ technology allows bonding wires to make contact with each other without electrical shorting, permitting fuller utilization of the x, y and z dimensions in microelectronic package design.
X-Wire™ is fabricated with a continuous insulating coating. Wire performance meets or exceeds typical industry standards. |
Insulated Wire bond technology |
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· Allows bond wire to touch without electrical shorting · Offers designers an option for denser designs using relaxed wire spacing rules · Reduced concern for wire sweep during molding · Provides control of bonding wire impedance with ground wires parallel to signal wires · Reduced overall package size · Reduced manufacturing defects |
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X-Wire™ allows wire bond contact without shorting
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Silicon Valley’s Packaging Foundry |
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© copy & copyright Promex Industries, Inc. & Microbonds, Inc. www.promex-ind.com 2009 |
