Microbonds insulated X-Wire™ technology allows bonding wires to make contact with each other without electrical shorting, permitting fuller utilization of the x, y and z dimensions in microelectronic package design.

 

X-Wire™ is fabricated with a continuous insulating coating. Wire performance meets or exceeds typical industry standards.

Insulated Wire bond technology

· Allows bond wire to touch without electrical shorting

· Offers designers an option for denser designs using relaxed wire spacing rules

· Reduced concern for wire sweep during molding

· Provides control of bonding wire impedance with ground wires parallel to signal wires

· Reduced overall package size

· Reduced manufacturing defects

    View Microbonds web site

 

        www.microbonds.com

  X-Wire™ allows wire bond contact without shorting

 

Silicon Valley’s Packaging Foundry

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