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JEDEC standard and custom QFN/ MLF / DFN over molded, saw singulated packages. All QFN packages are RoHS compliant. Ink stamp or serialized laser marking available. New JEDEC standard or custom package configurations are available in approximately 4 to 5 weeks ARO. Promex is a leader in developing and assembling stacked die, thin and system-in-package QFN configurations. Quick turns through pre-Asia volume production. |
Molded QFN & DFN Assembly |
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· RoHS compliant · JEDEC MO-220, MO-229 · NiPdAu plating standard · Saw singulated · Stacked die & SiP configurations · Microbonds X-Wire™ wire bonding option · Ink marking standard. Laser marking available. · Ask us about custom QFN package options including stacked die and thinned packages. |
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QFN/DFN for single, stacked die or SiP configurations |
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Silicon Valley’s Packaging Foundry |
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© copy & copyright Promex Industries, Inc. www.promex-ind.com 2007 |
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Promex QFN/ DFN Plastic Packages (all dimensions in millimeters) |
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size |
QFN leads |
DFN leads |
pitch |
Thickness (nom.) |
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2x2 |
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6, 8 |
0.50 |
0.9 |
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3x3 |
8 |
|
0.65 |
0.9 |
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3x3 |
12, 16, |
8, 10 |
0.50 |
0.9 |
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3x3 |
20 |
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0.40 |
0.9 |
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4x3 |
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12 |
0.50 |
0.9 |
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4x4 |
16 |
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0.65 |
0.9 |
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4x4 |
20,24 |
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0.5 |
0.9 |
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5x5 |
20 |
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0.65 |
0.9 |
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5x5 |
28, 32 |
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0.50 |
0.9 |
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6x6 |
40 |
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0.50 |
0.9 |
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7x7 |
48 |
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0.50 |
0.9 |
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7x7 |
56 |
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0.40 |
0.9 |
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8x8 |
52, 56 |
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0.50 |
0.9 |
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9x9 |
64 |
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0.50 |
0.9 |
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12x12 |
100 |
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0.40 |
0.9 |