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overview

Our Vision:

 

The Dominant Rapid Response Microelectronics Assembly Service Provider.

 

Our Mission:

 

To enable our customers to take new products to market faster than by any other route.

 

 

IC Assembly and Chip Packaging Competencies:

 

Wafer sawing to 300 mm

Automatic and semi-automatic die placement

Wire bonding: Au, Al, Copper, RF wedge, RF ribbon

Plastic Over Molding

IC Assembly: Over Molded Plastic (leaded & leadless), Ceramic,

   Open Top/ Air Cavity Plastic

Custom Package Development & Assembly: SiPs, LGA’s, MEMS Packaging, Medical Devices, Optoelectronics & Photonics, Sensors

 

 

SMT / PCBA (High Tech) & Assembly:

 

Consigned high mix, low volume, high tech

Strategic account turnkey materials

Shanghai high volume, cost saving, transfer SMT partner

 

 

 

© copy & copyright Promex Industries, Inc. www.promex-ind.com 2011

 2,400 square foot clean room

   includes Class 100 zones

Fully automated 01005 capable

     SMT lines used for SiP 

                integration

Silicon Valley’s Packaging Foundry