overview

Our Vision:

 

The Dominant Rapid Response Microelectronics Assembly Service Provider.

 

Our Mission:

 

To enable our customers to take new products to market faster than by any other route.

 

 

Key Chip Packaging Services:

 

QFNs (JEDEC standard and custom, single and stacked die)

IC Assembly: molded plastic and ceramic IC packaging

Wafer sawing and die singulation

Die attach

Wire bonding including Microbonds X-Wire™

Flip Chip: solder and ACF

LED & Sensor Arrays

Custom module development and assembly:

    SiPs, LGAs, MEMS, MOEMS, Nano, Optoelectronics

 

SMT & Assembly:

 

Consigned high mix, low volume

On shore full turnkey materials

Shanghai high volume SMT partner

 

 

 

© copy & copyright Promex Industries, Inc. www.promex-ind.com 2007

 2,200 square foot clean room

Fully automated 0201 capable

                SMT lines

Silicon Valley’s Packaging Foundry