JEDEC standard and custom QFN/ MLF/ DFN molded packages, saw singulated, with NiPdAu plating finish standard. Single and stacked die configurations. Custom packages available within 5 weeks.

 

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QFN / DFN molded plastic package assembly

IC assembly using plastic molded packages meeting Commercial or MIL-STD-883 for Si, GaAs and InP devices.
Text Box: more molded Plastic package IC Assembly Text Box: IC assembly using the many commercially available ceramic packages.

Ceramic package IC assembly

BGA assembly, wafer sawing, die attach, wire bonding, encapsulation, COB, COF, other services

additional ic assembly services
Text Box: Innovative Microbonds X-Wire™ allows wire bonding without concern of shorting due to wire contact after molding. Text Box: Microbonds x-wire™

Molded plastic package outline and bond shell drawings are available.

Package drawings

 

IC Assembly Services

To contact us call:

(1) 408.496.0222

Silicon Valley’s Packaging Foundry
8 HOUR QUICK TURNS THROUGH PRE-ASIA VOLUME PRODUCTION

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