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JEDEC standard and custom QFN/ DFN/ TQFN overmolded packages, saw singulated,  with NiPdAu plating finish standard.   Single, stacked die & SiP configurations.  Custom packages available within 5 weeks.  Access White Papers in our Knowledge Center for the QFN Parasitics Report.

 

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QFN / DFN / TQFN plastic OVERMOLDED package assembly

Promex developed and manufactured open (air) cavity packages in single package or package array format.  NEW!

OPEN (AIR) CAVITY QFN ASSEMBLY SERVICES

IC assembly using the many commercially available ceramic packages.

Ceramic package IC assembly

BGA assembly, wafer sawing, die attach, wire bonding, encapsulation, COB, COF, other services

additional ic assembly services

IC assembly of classic leaded packages meeting Commercial or MIL-STD-883 build standards.

leaded plastic over molded packaging

Molded plastic package outline and bond shell drawings available in pdf.

Package drawings for download
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IC Assembly Services

To contact us call:

+1.408.496.0222

Silicon Valley’s Packaging Foundry
8 HOUR QUICK TURNS THROUGH PRE-ASIA VOLUME PRODUCTION

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