Promex Custom Package Development & Assembly

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Overview

About Us

Management Team

IC Assembly

Custom Chip Packaging

SMT

Shanghai Partner

Knowledge Center

A distinctive competency of Promex is the ability to use our materials expertise and broad process knowledge to develop custom modules for high yield volume assembly. Microelectronics modules are process engineered taking into account materials synergies, thermal, reliability as well as overall size and cost reduction factors. Promex has expertise in RF & Wireless, Optoelectronics & Photonics, Commercial Electronics, Solar PV, Military, Medical Devices including implantables, Bio-Tech/ Bio-Metric packaging applications using a variety of substrates to provide scaleable materials-centric packaging.

Custom IC package development & assembly

Promex is experienced in developing and assembling System-in-Package (SiP) modules including 2D, 3D and Flip Chip configurations on various substrates and lead frame packages.

Our SMT capability allows an integrated, completely in-house assembly process flow.

System-in-package (SIP)

Custom modules are designed and developed using our Materials Centric Packaging expertise to meet or exceed today’s microelectronics challenges of higher performance and density with reduced size & cost. Our materials and process knowledge also extends to RoHS compliance.

Custom HIGH TECH modules

Promex pioneered materials-centric packaging and process development of various medical devices, including implantable applications.

Our packaging and assembly expertise provides material system selection & high yield process development. Optical chain and Image Sensor expertise.

Scalable capacity fast tracks scale up through ISO 13485 volume production.

Medical devices

We provide process development, materials centric packaging and assembly services to address the rapidly growing sensor and LED array markets.

Ceramic substrates and custom configurations of R, G, or B LED’s are die attached, wire bonded, light piped or encapsulated and continuity tested to your specifications.

PHOTONIC & Led arrays

Silicon Valley’s Packaging Foundry