Promex Custom Package Development & Assembly

A distinctive competency of Promex is the ability to use our materials expertise and broad process knowledge to develop custom modules for high yield volume assembly. Microelectronics modules are process engineered taking into account materials synergies, thermal, reliability as well as overall size and cost reduction factors. Promex has expertise in RF & Wireless, Optoelectronics & Photonics, Commercial Electronics, Solar PV, Security Card Electronic Inlay, Military and Bio-Tech/ Bio-Metric packaging applications using a variety of substrates.

Custom IC package development & assembly

Promex is experienced in developing and assembling System-in-Package (SiP) modules including 2D, 3D and Flip Chip configurations on various substrates and lead frame packages.

Our SMT capability allows an integrated, completely in-house assembly process flow.

System-in-package (SIP)

Custom modules are designed and developed using our Materials Centric Packaging expertise to meet or exceed today’s microelectronics challenges of higher performance and density with reduced size & cost. Our materials and process knowledge also extends to RoHS compliance.

Custom modules

Promex pioneered the use of ACF (anisotropic conductive film) for pre-Asia volume flip chip applications.

We are also experts with gold stud bumped, underfilled flip chip using compatible solder & flux systems as well as thermal compression flip chip processing.

We offer flip chip placement accuracies as low as 10 microns.

Flip chip technologies

We provide process development, materials centric packaging and assembly services to address the rapidly growing LED array market.

Ceramic substrates and custom configurations of R, G, or B LED’s are die attached, wire bonded, encapsulated and continuity tested to your specifications.

Led arrays

Silicon Valley’s Packaging Foundry