Promex Ceramic Package IC Assembly

Promex assembles using the many commercially available ceramic packages. Standard turn time is 4 to 5 days with quick turns provided from 8 hours through 72 hours. Multilayer ceramic packages and glass sealing options are also offered.

Ceramic package IC assembly

· Die Attach: eutectic, polyimide, JM7000, epoxy

· Wire bond: Ultrasonic Al or Au (2 mil option)

· Seal: Solder (AuSn), Glass, Adhesive

· Die attach: eutectic, polyimide

· Wire bond: Ultrasonic Al

· Seal: Glass

· Lead finish: Solder Coat

Multilayer 8L through 447L packages:

PGA (pin up & pin down)

LCC , Flat Pack, QFP, DIP

8L through 256L packages:

CDIP, CQUAD, CPAC

Silicon Valley’s Packaging Foundry